| Input Voltage | AC380V，50/60Hz |
|---|---|
| Process Gases | 0.3~0.4Mpa |
| Size | L930×W765×H1750mm (subject to the actual product) |
| Weight | About 500Kg |
| Appearance | White |
| Total Power | 4.5KW |
| Power supply | 1000W |
| Power | 13.56MHz/40KHz |
| Time from vacuuming to cleaning preparation | ≤60s |
| Vacuum line | All stainless steel pipes and high-strength vacuum bellows |
| Chamber Material | Stainless steel |
| Chamber Thickness | 20mm |
| Sealing | Militaries welding seal, ultimate vacuum degree <5Pa, leakage rate >15Pa/s |
| Chamber Internal Dimensions (Customizable) | 515×400×410mm(width×height×depth) |
| Effective Size of Electrode Plate (Customizable) | 430×290mm(width×depth) |
| Available Space Spacing (Customizable) | 32mm |
| Electrode Plate Arrangement (Customizable) | Horizontal electrode plates, plate spacing 48mm |
| Work Tray (Customizable) | 6-layer wire mesh pallet |
| Workspace (Customizable) | 6 layers |
| Process Gas Flow Range | 0~300SCCM |
| Process Gas Circuit (Customizable) | Standard configuration: Argon and oxygen two-way process gas（2 MFC） |
| Gas Pipeline | Teflon material |
| Control System | PLC (Siemens) |
| HMI | Touch interaction:7-inch touch screen (Siemens) |
| Control Mode | Automatic and manual mode control (switchable) |
Keylink Technology introduces the Plasma Treatment System for medium sized Panels in Printed Circuit Board Manufacturing and other related Applications.
Vacuum plasma is a suitable technology when your product or part requires treatment to all surfaces. Even 3D parts with hard to reach areas, are treated all over and are ensured an even and uniform treatment because of the vacuum that is build up in the treatment chamber.
Vacuum Plasma treatment is conducted in a controlled environment inside a sealed chamber, which is maintained at a medium vacuum, usually 0.1-1.0 mbar. The gas is energized by an electrical high-frequency field. The chamber is now filled with plasma, and all surfaces are ensured treatment.
Removing organic or inorganic matter, surface activtion, surface etching, wettability etc. getting a significant improvement using Vacuum Plasma technology.
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